FPGA Leadership

Xinnlinx offers a comprehensive multi-node portfolio to address requirements across a wide set of applications. Whether you are designing a state-of-the art, high-performance networking application requiring the highest capacity, bandwidth, and performance, or looking for a low-cost, small footprint FPGA to take your software-defined technology to the next level, Xinnlinx FPGAs and 3D/ICs provide you with system integration while optimizing for performance/watt.

What is an FPGA?

It is an acronym for field programmable gate array. It is a semiconductor IC where a large majority of the electrical functionality inside the device can be changed; changed by the design engineer, changed during the PCB assembly process, or even changed after the equipment has been shipped to customers out in the ‘field’.

FPGAs provide benefits to designers of many types of electronic equipment, ranging from smart energy grids, aircraft navigation, automotive driver’s assistance, medical ultrasounds and data center search engines – just to name a few.

Customer Benefits by Using FPGAs

Benefit
Details
Flexibility
FPGA functionality can change upon every power-up of the device. So, when a design engineer wants to make a change, they can simply download a new configuration file into the device and try out the change.
Often, changes can be made to the FPGA without making costly PC board changes.
ASSPs and ASICs have fixed hardware functionality that can’t be changed without great cost and time.
Acceleration
Get products to market quicker and/or increase your system performance.
FPGAs are sold “off the shelf” vs. ASICs (which require manufacturing cycles taking many months). Because of FPGA flexibility, OEMs can ship systems as soon as the design is working and tested.
FPGAs provide off-load and acceleration functions to CPUs, effectively speeding up the entire system performance.
Integration
Today’s FPGAs include on-die processors, transceiver I/O’s at 28 Gbps (or faster), RAM blocks, DSP engines, and more. More functions within the FPGA mean fewer devices on the circuit board, increasing reliability by reducing the number of device failures.
Total Cost of Ownership (TCO)
While ASICs may cost less per unit than an equivalent FPGA, building them requires a non-recurring expense (NRE), expensive software tools, specialized design teams, and long manufacturing cycles.
Intel FPGAs support long lifecycles (15-years or more), avoiding the cost of redesigning and requalifying OEM production equipment if one of the electronic devices on-board goes end of life (EOL).

XILINX

ARTIX
  • XC7
KINTEX
  • XCKU
  • XC7K
SPARTAN
  • XCS
  • XC7S
  • XC6S
  • XC3S
  • XC2S
VIRTEX
  • XCVU
  • XCV
  • XC7V
  • XC6V
  • XC5V
  • XC4V
  • XC5V
  • XC4V
  • XC4V

Intel / Altera

ACEX
  • EP20K
  • EP1K
ARRIA
  • EP2AG
  • EP1AG
  • 5AGX
  • 5AGT
  • 10AX
  • 10AT
CYCLONE
  • EP4C
  • EP3C
  • EP2C
  • EP1C
  • 5CGX
  • 5CGT
  • 5CEF
  • 5CEB
  • 10CX
  • 10CL
FLEX
  • EPF8
  • EPF6
  • EPF10K
MAX
  • 10M
STRATIX
  • EP4S
  • EP3S
  • EP2S
  • EP1S
  • 5SGX
  • 5SGS

Microsemi

ACT
  • A14
  • A12
  • A10
AXCELERATOR
  • AX500
  • AX250
  • AX2000
  • AX125
  • AX1000
EX
  • EX64
  • EX256
  • EX128
FUSION
  • U1AF
  • P1AF
  • M7AF
  • M1AF
  • AFS
IGLOO
  • M2GL
  • M1AG
  • AGL
MAX
  • 10M
MX
  • A42M
  • A40M
POLARFIRE
  • MPF500
  • MPF300
  • MPF200
  • MPF100
ProASIC
  • RT3P
  • M7A3
  • M1A3
  • APA
  • A3P
SX/SX-A
  • A54S

Lattice

CROSSLINK™
  • LIF-MD6000
  • LIA-MD6000
EC
  • LFEC
  • LEF5
  • LEF3
  • LFE2
ICE
  • ICE6
  • ICE5
  • ICE4
ISPGCX2
  • LX64
  • LX25
  • LX12
ISPXPGA
  • LFX
LA-EP
  • LAE5
  • LAE2
LA-PX2
  • LAXP
MACHXO
  • LCMXO
ORCA
  • ORT
  • ORS
  • OR3
  • OR2